Special Molybdenum Target

      Special Molybdenum Targets are high-purity sputtering materials specifically engineered for advanced thin-film deposition applications in semiconductor, display, photovoltaic, and electronic industries. Manufactured from premium molybdenum raw materials and processed through advanced powder metallurgy, forging, rolling, and precision machining technologies, our molybdenum targets offer excellent density, uniform grain structure, and superior sputtering performance.With high melting point (2623°C), excellent thermal conductivity, low thermal expansion coefficient, and outstanding corrosion resistance, these targets ensure stable deposition rates, extended target life, and consistent film quality throughout the sputtering process. The high purity and homogeneous microstructure help minimize particle generation, improve film uniformity, and enhance production efficiency in demanding vacuum coating environments.

· purity

High purity is a basic characteristic requirement for Special molybdenum target. The performance of the sputtered film improves with increasing molybdenum target purity.. The purity of ordinary molybdenum sputtering targets needs to be at least 99.95% (mass fraction, the same below). However, as the size of glass substrates in the LCD industry continues to increase, wiring lengths are required to be extended and line widths to become thinner. In order to ensure film uniformity and wiring quality , the purity requirements for molybdenum sputtering targets have also been increased accordingly. Therefore, depending on the size of the sputtering glass substrate and the use environment, the purity of the molybdenum sputtering target is required to be 99.99%~99.999% or even higher. Molybdenum sputtering target serves as the cathode source in sputtering. Impurities in the solid and oxygen and water vapor in the pores are the main sources of pollution for deposited films. In addition, in the electronics industry, alkali metal ions (Na+.K+) easily become mobile ions in the insulating layer, reducing the performance of components; elements such as uranium (U) and titanium (Ti) can release rays, causing the device to Soft breakdown; iron and nickel ions will cause interface leakage and increase in oxygen elements. Therefore, during the preparation process of Special molybdenum target, these impurity elements need to be strictly controlled to minimize their content in the target.

· Density

During the sputtering coating process, when the less dense sputtering target is bombarded, the gas in the internal pores of the target is suddenly released, causing sky-sized target particles or particles to splash, or the film material is bombarded by secondary electrons after film formation. The particles fly away. The presence of these particles degrades film quality. In order to reduce the solid dry pores in the target material and improve the film performance, the sputtering target material is generally required to have a higher density. For cone sputtering targets, their relative density should be above 98%.

· Target and chassis binding

Special molybdenum target must be connected to the oxygen-free copper (or aluminum and other materials) chassis before sputtering, so that the target and chassis conduct good thermal and electrical conductivity during the sputtering process. After binding, it must undergo ultrasonic inspection to ensure that the two are not combined by 2%. Only in this way can it meet the requirements of natural power sputtering without falling off.

·Grain size and size distribution

Usually Special molybdenum target have a polycrystalline structure, and the grain size can range from microns to millimeters. Experimental research shows that the firing rate of targets with fine-sized grains is faster than that of coarse-grained targets; and targets with smaller grain size differences, the deposited film thickness distribution is also more uniform.

· Crystal orientation

Because the target atoms are easily sputtered out preferentially along the direction of the closest hexagonal arrangement of atoms during sputtering, so in order to achieve the highest sputtering rate, the sputtering rate is often increased by changing the crystal structure of the target. The crystallographic direction of the target also has a great influence on the uniformity of the thickness of the sputtered film. Therefore, obtaining a certain crystalline orientation target structure is crucial to the thin film sputtering process.

Guideline：

GB/T3876-83, GB/T14592-93, QJ/BHZ02.68-89

Flat Panel Displays (FPD)

Ideal for wiring, matrix line electrodes, and barrier layers in TFT-LCD and OLED screens.In the past, flat panel display wiring materials were mainly hemorrhoids, but as flat panel displays become larger and more precise, materials with lower specific impedance are increasingly needed. In addition, environmental protection must also be considered. Molybdenum has the advantage of only 1/2 the specific impedance and film stress of chromium, and there is no environmental pollution problem, so it has become one of the preferred materials for sputtering targets for flat-panel displays.

Semiconductors & Microelectronic Packaging

As semiconductor manufacturing nodes continue to shrink, molybdenum and its specialized alloys (like Mo-Ti and Mo-Nb) are increasingly deployed as diffusion barriers, gate electrodes, contact metal layers, and capping layers in Integrated Circuits (ICs), power semiconductor devices, and MEMS. Positioned between dielectric materials and copper or aluminum interconnect lines, the molybdenum layer effectively prevents detrimental atom migration and interfacial reactions.

Photovoltaics & Thin-Film Solar Cells

Molybdenum serves as the universally accepted back-contact electrode layer in chalcopyrite-type thin-film solar modules, notably Copper Indium Gallium Selenide (CIGS) and Cadmium Telluride (CdTe) cells. As a back contact, the sputtered molybdenum layer must form a reliable ohmic contact with the absorber layer while remaining chemically inert during aggressive, high-temperature selenization or sulfurization processing.

Low-E Glass & Smart Functional Coatings

Large-scale inline magnetron sputtering utilizes pure molybdenum as well as Molybdenum-Niobium (Mo-Nb) and Molybdenum-Chromium (Mo-Cr) alloy targets to modulate the thermal and optical characteristics of modern architectural and automotive glass. In Low-Emissivity (Low-E) glass stacks, the molybdenum layer acts as a vital blocking, seeding, or sacrificial barrier designed to shield the ultra-thin silver (Ag) infrared-reflective layer from oxidation during severe high-temperature glass tempering and bending procedures.

 

Q:  How long is your delivery time?

A: Standard-size disc or rectangular targets are typically shipped within 2–3 weeks. Custom configurations, large rotatable targets, or assemblies requiring Indium bonding usually take 4–5 weeks.

Q: How do you control the purity and quality of your targets?

A: We manage quality starting from raw material powders. Every batch undergoes Chemical Composition Testing and Grain Size Analysis. Final products receive a comprehensive Certificate of Analysis (COA) containing GDMS impurity test results and Ultrasonic Testing (UT) reports for structural integrity.

Q:Can you provide alloy targets like Mo-Ti or Mo-Nb?

A: Yes. We specialize in binary and multi-component molybdenum alloys (e.g., Mo-Ti 50/50 wt%, Mo-Nb 90/10 at%). Our proprietary powder blending technology prevents phase segregation, ensuring perfectly uniform composition throughout the entire target volume.

Q:Can you provide a sample?

A: Of Course,We Can Send Free Samples For Your Test According To Your Needs, You Only Need To Pay A Small Amount Of Shipping.

Q:What Is The MOQ?

A: This Product Is A Customized Product, Which Is Generally Provided According To The Drawings. If You Want To Test The Sample First, We Can According To The Stock Size, 1 Piece Is Also Available.

Q:What Kind Of Certificates Do You Have?

A: We Own ISO 9001, CE, And More.Please Get In Touch With Our Sales Staff Directly For Additional Information.

 

why choose us

 

 

Ehisen

 

Shaanxi EHISEN Technology Co., Ltd. is a premier manufacturer specializing in high-performance refractory metals and advanced coatings with over 20 years of deep industry expertise. Backed by 15+ national patents and a strict ISO 9001 quality management system, we deliver custom-engineered target materials to more than 520 clients globally.

Our state-of-the-art facility integrates the entire production chain-from raw material powder preparation and compacting to sintering, rolling, machining, and backing plate bonding. Equipped with advanced testing instruments including GDMS (Glow Discharge Mass Spectrometry) for trace impurities, Ultrasonic C-Scan for bonding integrity, and Metallographic Microscopes for grain size analysis, EHISEN guarantees 100% traceability and elite performance for every batch shipped.

 

 

 

 

Details of Packing: Following testing, eligible products will be packaged in accordance with the export packaging or with soft paper inside a wooden case outside.

 

Delivery Information: 3–15 working days after delivery; the titanium ball is packaged with extreme care, caution, and security.

 

For you, we will select the most expedient, economical, and secure shipping method among express, air, and sea shipping.

 

Prior to delivery, our customer will receive photographs of the completed products, information on the packaging, and the MTC after they are satisfied with our offering.We will deliver the goods on time. the images you view accurately depict the merchandise.

 

 

 

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