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Titanium Anode for Reverse Pulse Copper Plating
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Titanium Anode for Reverse Pulse Copper Plating

Titanium Anode for Reverse Pulse Copper Plating

Plating process:bidirectional pulse
Temperature:20℃-50℃
Copper ion source:horizontal pulse - oxygen-free copper,oxygen precipitation pulse - copper oxide powder
Sample testing available
Benefits:Effective in improving the quality and efficiency of electronic equipment manufacturing
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What is titanium anode for reverse pulse copper plating?

 

   Throwing power is increased by PCB copper reverse pulse plating,especially in items with a high aspect ratio. In vertical mode,it can run at current densities comparable to or higher than traditional DC,while in horizontal mode,it can work at current densities noticeably higher.
Often employed as pellets or balls,copper anodes generate particulate matter that needs to be filtered out of the solution since the plating solution needs to be free of these anode debris.To solve this problem,the soluble copper anode should be replaced by an insoluble anode, like a dimensional stable anode (DSA).The titanium substrate used in DSA anodes is typically covered in a layer of noble metals such as ruthenium,tantalum,iridium,or other platinum groups of precious metals.

 

   Ehisen manufacture iridium coated titanium anode for PCB reverse pulse copper plating which can operate under high current densities but not get passivated.It is made using a unique process and customized coating, which allow for uniform current production and an extended service life.

 

Titanium Anode for Reverse Pulse Copper Plating supplier

 

high quality Titanium Anode for Reverse Pulse Copper Plating

 

Low price Titanium Anode for Reverse Pulse Copper Plating
Parameters of PCB reverse pulsation copper plating

 

Parameters of PCB reverse pulsation copper plating

Copper ion source

Horizontal pulse - Oxygen-free copper, Oxygenating pulse - Copper oxide powder

Electrolytes

Horizontal pulses:CuSO4 -5H2 O, H2 SO4 ,Fe3+/Fe2+

Additives

Oxygen separation pulses:CuSO4 -5H2 O,H2 SO4 ,Additives

Temperature

20℃-50℃

Current Density

Positive pulse current 200-800A/㎡

Reverse pulse current 600-2400A/㎡

Pulse frequency

Adjustment according to actual working conditions

Anode type

Specialized mixed precious metal (iridium) oxide coated anode

Anode life

Greater than one year (or custom design according to customer requirements)

 

Product Features

 

Titanium Anode For Reverse Pulse Copper Plating condition

●Custom coating for reverse pulse plating;

●Long service lifetime;

●High current efficiency performance;

●Exceptional copper thickness uniformity;

●Excellent throwing power;

●Tailor-made service is available.

 

 

Applications Of Titanium Anode For Reverse Pulse Copper Plating

 

Copper Plating of Printed Circut Boards;
Horizontal Electroplating;
Industrial acid copper plating;
Precious metal plating.

 

Titanium Anode For Reverse Pulse Copper Plating application

 

Titanium Anode For Reverse Pulse Copper Plating factory

 

Type of transportation

 

Titanium Anode for Reverse Pulse Copper Plating producer

 

professional made Titanium Anode for Reverse Pulse Copper Plating

 

FAQ about Titanium Anode for Reverse Pulse Copper Plating

 

Q: How to choose the right titanium anode?

A: The first thing to consider is that the material and size of the anode match the matrix,which helps maintain the stability of reverse pulse copper plating.Secondly,we must choose a titanium anode manufacturer with reliable quality and ensure the cleanliness and smoothness of the anode surface.

Q: Will the titanium anode be damaged during the reverse pulse copper plating process?

A: Titanium anodes have higher corrosion resistance and stability than other materials,so they are not easily damaged during the reverse pulse copper plating process.However,in order to maintain the anodes, it is necessary to regularly clean and check the surface condition of the anodes,and replace damaged anodes in a timely manner.

Q: How to avoid impurities and contamination during reverse pulse copper plating?

A: In the preparation stage for reverse pulse copper plating,the composition and temperature of the reaction solution must be strictly controlled to avoid impurities and contamination caused by changes in the reaction solution.At the same time, pay attention to the distance between the anode and cathode,control the current density, and avoid the generation of excessive hydrogen and foam.Finally, the reactor and tools must be cleaned regularly to ensure the cleanliness of the reaction system.
contact us

Tel :

+86 15619363855 Edward Wu
+86 18700703333 Elsa lin

+86 15291791403 Eve

+86 18896992206 Leo Liu

 

FAX : 0917-3381186

 

Email : edwardwu@ehisen-anode.com
admin@ehisen-anode.com
info@ehisen-anode.com
leoliu@ehisen-anode.com

 

Add: No. 28, Gaoya Industrial Park, Gaoxin District, Baoji City, Shaanxi Province

 

 

 

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